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Home » Computer Products, Telecom Products

STMicro Unveils 5MPixel Wafer Level Camera in 3D TSV / WLP Package

Submitted by admin on March 11, 2010 – 3:54 pmNo Comment

STMicro today unveiled details of its roadmap for new 5MPixel CMOS image sensors in the standard quarter-inch optical format commonly used in camera-phone handsets. ST痴 latest leading-edge sensors offer the possibility to integrate eDOF and WLP / TSV advanced packaging technologies.

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